为了减小激光刻蚀微坑表面的再铸层及增加刻蚀微坑的深度,利用双声光调制技术,通过对比0.25,7.5和200μs 3个不同量级脉宽,及对比单峰、双峰和三峰等不同激光脉冲波形的激光脉冲刻蚀微坑形貌,来研究激光脉宽及脉冲波形对刻蚀微坑形貌的影响。结果表明,激光脉宽为0.25μs时毛刺较多,脉宽为200μs时表面熔凝现象明显,脉宽为7.5μs时表面熔凝现象及毛刺都明显减少;单峰波形刻蚀微坑表面毛刺较多,深度为7.5μm,三峰波形刻蚀微坑表面出现熔凝现象,深度为10μm,双峰波形刻蚀微坑表面毛刺及熔凝最少,深度为15μm。 In order to reduce the recast layer on the surface of the micro-pit by laser etching and increase the depth of micro-pit etching, by using two-acousto-optic modulation technology, comparing the pulse widths of three different orders of 0.25, 7.5 and 200 μs, Peak and three peaks and other different laser pulse laser pulse shape of the micro-pit etching to study the impact of laser pulse width and pulse waveform on the morphology of the etching pit. The results show that when the pulse width is 0.25μs, there are more burrs and the surface melting phenomenon is obvious when the pulse width is 200μs. The surface melting phenomenon and burrs are obviously reduced when the pulse width is 7.5μs. And the depth was 7.5μm. The surface of the mite pit on the miter wave etching appeared to be fused at a depth of 10μm. The burr and the fusing on the bimodal mite pit were the least with the depth of 15μm.