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对接地的考虑,由电源引起的噪声处理技术;由感应、反射引起的噪声处理;由IC(集成电路)引起的噪声处理;实际装配中的噪声处理;考虑了噪声余度的IC的选用方法;用电路结构提高耐噪声能力。
Grounding Considerations, Noise Handling Techniques Caused by Power Supplies; Noise Handling Induced and Reflected; Noise Handling Caused by ICs (Integrated Circuits); Noise Handling in Actual Assemblies; Selection of ICs Considering Noise Margin ; With the circuit structure to improve resistance to noise.