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在前期设计卫星大功率电子设备地面测试用通风散热系统的基础上,对系统散热性能进行了优化设计,对不同结构参数下电子器件的空气射流强化散热开展了数值仿真.研究结果表明系统中喷嘴出口直径、喷嘴出口至换热面距离、射流倾斜角以及喷嘴出口风速等参数对散热性能均有直接影响,并给出了定量的无量纲参数优化设计结果.该结论也可应用于表面热流密度为1 k W/m2级电子器件散热的优化设计,并为星载大功率电子设备对流式热控系统设计和地面测试提供技术参考.
On the basis of pre-design ventilation and cooling system for ground testing of high-power electronic equipment, the heat dissipation performance of the system was optimized and numerical simulation was carried out for the air-jet heat dissipation of electronic devices with different structural parameters.The results show that the nozzle The parameters such as outlet diameter, nozzle exit to heat transfer surface distance, jet tilt angle and nozzle exit velocity have a direct influence on the heat dissipation performance, and the quantitative design results of dimensionless parameters are given.The conclusion can also be applied to the surface heat flux density It is the optimal design of heat dissipation for 1 k W / m2 electronic devices and provides technical reference for convection thermal control system design and ground test of on-board high-power electronic devices.