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介绍了一种利用计算流体动力学分析软件和有限元法多物理场分析软件对功率微波单片集成电路(MMIC)封装进行电热及热力特性数值模拟的方法。首先对功率MMIC封装的热传导路径及等效热模型进行了简化分析,基于简化模型对影响热分布和热传导的因素进行分析,并提取其材料和结构参数,建立功率MMIC封装的热模型,并对一款S波段5 W功率放大器MMIC封装进行仿真,得到功率MMIC及其封装的温度分布,仿真结果均与实际测试结果相吻合。所建立的简化模型和热应力分析对功率MMIC及其封装结构的设计和改进具有指导意义。
A method for numerical simulation of electrothermal and thermal characteristics of a power microwave monolithic integrated circuit (MMIC) package using computational fluid dynamics analysis software and finite element multiphysics analysis software is presented. First, the thermal conduction path and equivalent thermal model of power MMIC package are simplified. Based on the simplified model, the factors that affect the thermal distribution and thermal conduction are analyzed. The material and structural parameters are extracted and the thermal model of power MMIC package is established. An S-band 5 W power amplifier MMIC package was simulated and the temperature distribution of the power MMIC and its package was obtained. The simulation results are consistent with the actual test results. The established simplified model and thermal stress analysis are instructive in the design and improvement of power MMIC and its package structure.