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为了提高纯铜表面的耐磨性能,采用电镀/浆料包渗相结合的方法,以TiO2粉为渗Ti源,纯Al粉为还原剂,在Cu表面预镀Ni随后表面浆料包渗Ti-Al,制备Ti-Al共渗层。研究了包渗温度对Ti-Al渗层组织和耐磨性能的影响。采用SEM和XRD分析了渗层表面形貌和结构。结果表明:在800～950°C共渗12 h时,随着温度的升高,渗层组织变化过程为NiAl+Ni3(Ti,Al)→NiAl+Ni3(Ti,Al)+Ni4Ti3→Ni4Ti3+NiAl→NiAl+Ni3(Ti,Al)+NiTi;Ti-Al渗层的摩擦因数随着包渗温度的升高而降低,最小摩擦因数约为纯铜的1/3,最小硬度为纯铜的5倍。
In order to improve the wear resistance of pure copper surface, the combination of electroplating / slurry package infiltration method to TiO2 powder infiltration Ti source, pure Al powder as reductant, pre-plated on the Cu surface Ni Ni infiltration -Al, to prepare a Ti-Al co-diffusion layer. The effect of temperature on the microstructure and wear resistance of Ti-Al infiltrated layer was studied. The surface morphology and structure of the layer were analyzed by SEM and XRD. The results show that the microstructure of the infiltrated layer changes with the increase of temperature at 800-950 ° C for 12 h. The microstructure of the infiltrated layer is characterized by NiAl + Ni3 (Ti, Al) → NiAl + Ni3 (Ti, Al) + Ni4Ti3 → Ni4Ti3 + NiAl → NiAl + Ni3 (Ti, Al) + NiTi; the friction coefficient of Ti-Al layer decreases with the increasing of the infiltration temperature, the minimum friction coefficient is about 1/3 of the pure copper, the minimum hardness is pure copper 5 times.