论文部分内容阅读
Platinum, palladium and their alloy films on polyimide were formed by catalyst-enhanced chemical vapor deposition (CVD) in the carrier gas (N2, O2) at 220-300 ℃ under reduced pressure and normal pressure. The deposition of palladium complexes [ Pd((η3-allyl)(hfac) and Pd(hfac)2 ] gives pure palladium film,while the deposition of platinum needs the enhancement of palladium complex by mixing precursor platinum complex Pt(COD)Me2 and palladium complex in the same chamber. The co-deposition of Pd and Pt metals was used for the deposition of alloy films. During the CVD of palladium-platinum alloy, the Pd/Pt atomic ratios vary under different co-deposition conditions. These metal films were characterized by XPS and SEM, and show a good adhesive property.