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本文研究了增加流体静压力对处于不同温度、pH值为7.8的海水中的铜腐蚀可能产生的影响。试验是在压力为1、50、100、200和300大气压、温度为5℃、10℃和20℃条件下进行。进行试验所用的压力装置系利用液气泵增压,该装置不仅备有一个工作电极,而目还有两个用于电化学试验的铂电极和一个Ag-AgCl参比电极。业已发现,增面压力往往加速铜的腐蚀,升高温度则亦使腐蚀速率增加。当温度T=20℃,D.O=7.0 ppmi)以及压力为150大气压、pH=7.8时腐蚀速度达最大增值(71％)。但当温度接近5℃、压力为150大气压时其最大增值不超过30％。试验结果指出,温度≤10℃时增加压力对阳极过程无影响,仅对阴极还有影响;而当温度为20℃时阳极过程也明显加速,并发现压力的影响更为突出。
This paper studies the possible effects of increasing hydrostatic pressure on copper corrosion in seawater at different temperatures and pH of 7.8. The tests were carried out at pressures of 1, 50, 100, 200 and 300 atmospheres, at a temperature of 5 ° C, 10 ° C and 20 ° C. The pressure device used for the test was pressurized by a liquid-gas pump. The device not only had one working electrode, but also two platinum electrodes for electrochemical tests and one Ag-AgCl reference electrode. It has been found that increasing the pressure tends to accelerate the corrosion of copper and increasing the temperature increases the corrosion rate. When the temperature T = 20 ℃, D.O = 7.0 ppmi) and the pressure of 150 atmospheres, the maximum corrosion rate reaches 71% at pH = 7.8. However, when the temperature is close to 5 ℃, the pressure is 150 at maximum pressure value does not exceed 30%. The experimental results show that when the temperature is lower than 10 ℃, the increase of pressure has no effect on the anode process and only affects the cathode. When the temperature is 20 ℃, the anode process also accelerates obviously and the influence of pressure is more prominent.