论文部分内容阅读
一种被称为连续颗粒硅(continuous-grain silicon, CG-Silicon)的衬底技术使器件的集成度达到了前所未有的水平,并预示着下一代移动和手持式产品即将出现。最终,就连设备的CPU都将被集成到衬底上。
A substrate technology called continuous-grain silicon (CG-Silicon) has brought devices to an unprecedented level of integration and signals the imminent emergence of next-generation mobile and handheld products. Eventually, even the device’s CPU will be integrated onto the substrate.