以聚氧乙烯化合物(“Carbowax4000”)为添加剂的动力学的化学镀铜液已有过研究。铜离子、氢氧离子和甲醛的浓度是变化的。聚氧乙烯化合物对金属表面的影响还在讨论中。在化学镀铜液中已制备和应用新化合物聚氧乙烯十二基烷硫醚。新化合物分子中既含有一个能稳定化学镀铜液的含硫官能团,同时也含有能调节电镀速率得到较好质量铜层的聚氧乙烯官能团。在化学镀铜液中聚氧乙烯和聚氧乙烯硫醚化合物浓度的影响由添加剂中含有不同数目的聚氧乙烯官能团来进行比较。 Kinetics of electroless copper plating with polyoxyethylene compounds (“Carbowax 4000”) as additives have been studied. Copper ion, hydroxide ion and formaldehyde concentrations vary. The effect of polyoxyethylene compounds on the metal surface is still under discussion. In the electroless copper plating solution has been prepared and applied a new compound polyoxyethylene dodecyl sulfide. The new compounds contain both a sulfur-containing functional group that stabilizes the electroless copper plating solution and a polyoxyethylene functional group that regulates the plating rate to give a better quality copper layer. The effects of the concentrations of polyoxyethylene and polyoxyethylene sulfide compounds in the electroless copper plating solution are compared by the additives containing different numbers of polyoxyethylene functional groups.