介绍了一种比较新颖的、技术要求比较高的,能广泛应用于HDI技术领域的超薄铜箔,并且通过其在图形电镀中的应用及激光钻孔后的电镀效果研究,可以充分体会到这种铜箔优异的性能。 This paper introduces a new and ultra-thin copper foil which can be widely used in HDI technology, which is relatively new and high in technical requirement. Through its application in pattern electroplating and the research of electroplating effect after laser drilling, This copper foil excellent performance.