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光互联技术相对于传统的电互联技术具有高速、高带宽、低功耗、低损耗和抗电磁干扰等优势,在高性能计算机、高速交换系统及波分复用(WDM)终端等方向都具有巨大的应用前景。板级电路在电子系统中占据主导地位,就国内外板级波导光互联技术研究现状进行了阐述与分析,并对光电印制电路板(EOPCB)国内外发展水平进行了对比,为我国在该技术领域未来的主要研究方向及重点提供参考。最后对板级光电互联技术的发展趋势进行了展望。
Compared with the traditional electrical interconnection technology, optical interconnection technology has the advantages of high speed, high bandwidth, low power consumption, low loss and anti-electromagnetic interference, and has the advantages in high performance computers, high speed switching systems and WDM terminals Huge application prospects. Board-level circuits dominate the electronic system. The status quo of research on optical interconnection at the domestic and international board-level waveguides is described and analyzed. The development level of the optoelectronic printed circuit board (EOPCB) at home and abroad is compared. The future of the major areas of technology research and focus on providing a reference. Finally, the development trend of board-level optical interconnection technology is prospected.