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主要研究电流密度为5×103A/cm2,室温和高温(100℃)条件下共晶SnBi焊点的电迁移特性。结果表明:室温条件通电465h后,阳极界面处出现Bi的挤出,阴极界面处出现裂纹;而在高温条件下通电115h后,组织形貌发生了很大的变化。高温加速了阴极钎料的损耗,导致电流密度在局部区域高度集中,从而产生更多的焦耳热,最终引发焊点的熔化。熔融状态下Sn原子与Cu反应,在基体形成大量块状的Cu6Sn5金属间化合物,严重降低焊点的可靠性。
The main study of the current density of 5 × 103A / cm2, room temperature and high temperature (100 ℃) eutectic SnBi solder electromigration characteristics. The results show that after 465h at room temperature, Bi extrusion occurs at the anode interface and cracks occur at the cathode interface. However, the morphology changes greatly after 115h at high temperature. The high temperature accelerates the loss of the cathode solder, resulting in a high concentration of current density in localized areas, resulting in more Joule heat and eventually melting of the solder joints. In the molten state, the Sn atom reacts with Cu to form a large amount of massive Cu6Sn5 intermetallic compound in the matrix, which seriously reduces the reliability of the solder joint.