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目前导热的电模拟仅限于无內热源的导热。本文讨论有内热源时稳定导热的电模拟,得出模拟拟电路,提出线性热路叠加原理。以无限大平板为例,进行了电模拟计算。用含参变量的积分解决了温度叠加和热流叠加的问题。根据计算结果,引出一个新概念——偏心距,用它可迅速确定板内最高温度的位置。
The current thermal simulation is limited to thermal conductivity without internal heat source. In this paper, we discuss the electrical simulation of stable thermal conductivity with internal heat source, and get the simulated analog circuit, and put forward the principle of superposition of linear thermal circuit. Taking an infinite flat as an example, the electrical simulation is carried out. Solving the problem of superposition of temperature and superposition of heat flow with integrals with parametric variables. According to the calculation results, a new concept - eccentricity, leads to a quick determination of the position of the highest temperature inside the plate.