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用等通道转角挤压法对 Cu-Al-Be-B 形状记忆合金进行了晶粒细化,并通过内耗实验(IF)对合金晶粒细化前后的内耗性能做了测试和分析。内耗循环测试结果表明,由于晶粒尺寸及其亚结构的细化,晶粒细化后的合金相变内耗峰 IF1比铸态合金低。但是,晶粒细化后合金的 IF1具有较好的稳定性,这是由于马氏体相的增多、晶界的净化和位错密度降低所致。进一步分析表明,IF1是由相变带来的体积变化和相界面的运动引起。在较低温度区间,出现了由马氏体孪晶畴的细化/粗化和亚结构运动引起的内耗峰。
The grain refinement of Cu-Al-Be-B shape memory alloy was carried out by the equal-channel angular extrusion method. The internal friction performance before and after the grain refinement of alloy was tested and analyzed by internal friction experiment (IF). The internal friction cycle test results show that, due to the grain size and its substructure refinement, the grain refinement of the alloy IFIF1 than the as-cast alloy low. However, the grain refinement of IF1 alloy has better stability, which is due to the increase of martensite phase, the grain boundary purification and dislocation density decreased. Further analysis shows that IF1 is caused by the volume change caused by the phase transition and the movement of the phase interface. In the lower temperature range, there appears the internal friction peak caused by the refinement / coarsening of the martensite twin domains and the sub-structure movement.