The compact Cu coating with smooth surface and refined grain was prepared at high current density by mechanical attrition enhanced electroplating(MAEE) process. The mechanical attrition(MA) action was supplied by the vertical movement of glass balls on the sample surface with a special vibrating frequency. The plating bath was CuSO4 and H2SO4. It is demonstrated from field emission scanning electron microscopy(FESEM) results that the new coating shows smooth and refined surface morphology in high speed MAEE process. The further studies show that the spherical grain or pillar-shape grain can be obtained by traditional electroplating process at the current density of 200-600 mA/cm2. And the coatings are loosen, porous and easy to brush off. The pyramid-shape grain with diameter of less than 1 μm was obtained by MAEE process under the same condition. And the coatings are compact and pore-free. The rapid electroplating process can be obtained by MA action.