论文部分内容阅读
以电子束真空熔炼直接定向凝固技术制备5N高纯铜大铸锭为研究目标,利用电子束熔炼原材料,熔体直接定向凝固后得到高纯铜铸锭。采用GDMS-VG9000辉光放电质谱仪和TCH600氧氢分析仪研究了金属杂质及氧氢元素的去除效果,通过EPMA-1600电子探针研究了提纯后元素的分布情况。结果表明:真空电子束熔炼直接定向凝固技术可将原料为4N(99.9988711%)的电解阴极铜板,制备出纯度5N(99.9997235%)、Φ59mm大尺寸高纯铜铸锭,杂质元素总量降低了75.506%,中间凝固组织为单晶;五种含量较高的元素Ag、Cu、O、P和S均匀分布,没有出现杂质的偏聚现象;与原材料相比,O、H元素分别降低了86.47%,85.00%。研究表明真空电子束精炼直接定向凝固技术能够制备氧氢含量较低的5N大尺寸高纯铜铸锭。
Electron beam vacuum smelting direct directional solidification technology preparation of 5N high purity copper ingot for the research objectives, the use of electron beam melting raw materials, melt direct solidification obtained after high purity copper ingot. The removal of metal impurities and oxygen and hydrogen were studied by GDMS-VG9000 glow discharge mass spectrometer and TCH600 oxygen analyzer. The distribution of the purified elements was studied by EPMA-1600 electron probe. The results show that the direct solidification technology of vacuum electron beam melting can make 4N (99.9988711%) electrolytic copper cathodes and prepare 5N (99.9997235%) pure copper ingots with Φ59mm large size and reduce the total amount of impurity elements by 75.506 %, And the middle solidified structure is single crystal. The five high content elements Ag, Cu, O, P and S are uniformly distributed, and no segregation of impurities occurs. Compared with the raw materials, the content of O and H decreases by 86.47% , 85.00%. The results show that the vacuum electron beam direct solidification technology can prepare 5N large size high purity copper ingot with low oxygen content.