论文部分内容阅读
本文阐述了通过密封环周围的流体动力学研究,改善微孔冷却特性,合理选择密封材料和参数,可使粘滑现象消失。
This article describes the fluid dynamics through the seal around the ring to improve the cooling characteristics of microporous, a reasonable choice of sealing materials and parameters, stick slip phenomenon can disappear.