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针对电子信息工业对新型结构功能一体化电子封装材料的应用需求,采用喷射成形与热压致密化相结合的方法制备高Si含量(质量分数为50%～70%Si)的系列Si-Al合金,并利用金相显微镜、扫描电镜、硬度测试仪、热膨胀仪等手段研究该材料的显微组织、力学性能和热物理性能。结果表明,喷射成形高硅铝合金的沉积态显微组织细小弥散,初生硅呈不规则形状,均匀弥散地分布在铝基体中;对沉积坯件进行适当的热压致密化处理可以有效地消减喷射成形制坯工艺过程中所形成的疏松和孔洞,提高材料的致密度。经热压致密化处理的喷射成形高硅铝合金材料具有优越的热物理性能以及良好的力学性能,是一种综合性能优越的结构功能一体化电子封装材料。
Aiming at the application demand of the electronic information industry for the new structural and functional electronic packaging materials, a series of Si-Al alloys with high Si content (mass fraction of 50% -70% Si) were prepared by a combination of spray forming and hot pressing densification The microstructure, mechanical properties and thermophysical properties of the material were studied by metallographic microscope, scanning electron microscopy, hardness tester and thermal dilatometer. The results show that the as-deposited microstructure of spray-formed high-silicon aluminum alloy is finely dispersed and the primary silicon is irregularly shaped and dispersed uniformly in the aluminum matrix. Appropriate hot-pressing densification of the deposited blank can effectively reduce Spray forming blank during the formation of loosening and holes to improve the density of the material. The hot-pressed densified spray-formed high-silicon aluminum alloy has superior thermophysical properties and good mechanical properties, and is an integrated electronic packaging material with structural functions and superior performance.