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以甲醛、苯酚为原料,草酸为催化剂,在不同条件下合成了系列热塑性电子封装级酚醛树脂材料。通过正交试验研究了原料物质的量比、反应温度、时间、催化剂用量等因素对树脂黏度、软化点、羟基值等参数的影响。正交试验的结果表明:反应温度为树脂黏度、羟基值的主要影响因素,而催化剂的量、原料物质的量比为树脂软化点的主、次要影响因素。
Using formaldehyde and phenol as raw materials and oxalic acid as catalyst, a series of thermoplastic electronic package-level phenolic resin materials were synthesized under different conditions. The effects of the ratio of raw materials, the reaction temperature, the time and the amount of catalyst on the viscosity, softening point and hydroxyl value of the resin were studied by orthogonal test. The results of orthogonal test show that the reaction temperature is the main factor affecting the viscosity and hydroxyl value of the resin, while the amount of catalyst and the ratio of raw materials are the main and secondary influencing factors of resin softening point.