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随着集成电路封装产业的高速发展，切筋工艺在其封装生产中的地位也不断上升，然而传统的手动切筋作业方式严重阻碍了IC封装生产效率的发展。目前，PLC技术在工控领域得到广泛应用，软件设计方法已逐步完善，适合运用于自动切筋分离系统的设计开发中。该课题中涉及的MCM?3D封装工艺，运用低弧度立体键合技术、集成电路智能塑封系统、自动切筋分离系统等多项研发成果。开发了PLC自动控制系统，设计了切筋模具定位结构、切筋刀具和自动推料装置等，利用光纤传感器，结合PLC定位电路和PLC反馈控制系统，实现了切筋工艺的自动化，提高了切筋工序的生产效率，降低了故障率和安全风险，控制了人工和设备成本。“,”With the rapid development of the integrated circuit package industry,the position of trimming in the IC package production rises continuously,but trimming in the traditional manual way is now hindering the production progress. Currently, PLC technology has been widely applied in the field of industrial control,and its software design methods have been gradually improved. It is suitable for use in the research of automatic trimming separation system. The MCM?3D package technology is in?volved in the subject,in which the low arc?dimensional bonding technology,IC automatic packaging system,automatic trim?ming separation system and so on are adopted. PLC control system was developed. A device for positioning the trimming mold, automatic pushing devices and cutting tools were designed. The automation of trimming process was realized by fiber optic sen?sors,PLC positioning circuit and PLC feedback control system,which improved the trimming process productivity,reduced the fault rate and risk of operators,and cut down the costs of labor and equipment.