针对大功率LED阵列的热控问题,提出了一种内凹形(“Ω”形)铜基微通道热沉,并采用数值模拟(CFD)方法分析对比了其与常见矩形微通道热沉的性能。此外,还对其在不同流速、进口水温、热流密度下的单相对流传热、流动性能进行了研究。结果表明,该内凹形微通道较常见的矩形微通道热沉,通过减少泵功损失获得了更高的综合性能;采用较高的流速和较小的进口水温能够提高其换热性能,增大热沉底面温度均匀性,从而提高LED的寿命和稳定性;雷诺数约为300时,层流向湍流转捩。 In order to solve the thermal control problem of high power LED array, a concave (“Ω” shape) copper-based microchannel heat sink is proposed. Its numerical simulation (CFD) method is compared with that of common rectangular microchannels Shen performance. In addition, its single-phase convective heat transfer and flow properties under different flow rates, inlet water temperature and heat flux density were also studied. The results show that the microchannel microchannel heat sink, which is more common, has a higher overall performance by reducing the pumping losses. The higher flow rate and smaller inlet water temperature can increase the heat transfer performance. Large heat sink bottom temperature uniformity, thereby enhancing the life and stability of the LED; Reynolds number of about 300, laminar flow to turbulent transition.