论文部分内容阅读
Au Ge_(12)合金是一种低熔点共晶材料,共晶温度为356℃。可用作半导体、微波器件中的欧姆接触材料。它与N 型Ga As 可形成较好的欧姆接触,因此被认为是一种比较理想的溅射、蒸发源。同时Au Ge_(12)合金还广泛地用作晶体管、集成电路等元件的低熔点焊料。虽然Au Ge_(12)合金有很多用途,但由于在室温下的组织是由富Au 的α固溶体和纯Ge 组成的共晶体,而Ge 的晶体点阵又是金刚石型的,所以该合金很脆,加工性能很差。使用受到了限制。
Au Ge_ (12) alloy is a low melting point eutectic material with eutectic temperature of 356 ℃. It can be used as ohmic contact material in semiconductors and microwave devices. It forms a good ohmic contact with N-type GaAs, so it is considered to be an ideal sputtering and evaporation source. At the same time, Au Ge 12 alloy is also widely used as a low melting point solder for transistors, integrated circuits and other components. Although the Au Ge 12 alloy has many uses, the alloy is very brittle since the microstructure at room temperature is a co-crystal composed of an Au-rich α solid solution and pure Ge and the Ge crystal lattice is diamond-shaped , Processing performance is poor. Limited use.