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本文按软钎剂中活化物质的类别叙述了它们在钎焊过程中的化学活性和物理活性。指出含胺或含酸配位体与铜离子形成的氯化物或溴化物是主要的活性物质。这些配位化合物在热分解过程中可以析出活性铜。向这些配位化合物中添加铜的氧化物或氯化物又可增加活性铜的析出量。后者与融熔钎料可以形成活性合金层。从而改善了液固气相间接触表面的化学、物理性能,提高了相互间的润湿,漫流与助焊作用。
In this paper, the types of activators in the flux are described for their chemical activity and physical activity during brazing. It is pointed out that the chloride or bromide formed by amine-containing or acid-containing ligands and copper ions is the major active species. These complexes can precipitate active copper during thermal decomposition. Addition of copper oxide or chloride to these complex compounds increases the amount of active copper deposited. The latter and the molten solder can form an active alloy layer. Thus improving the chemical and physical properties of the contact surface of the liquid-solid gas phase, and improving the mutual wetting, diffusing and fluxing effect.