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应用电弧离子镀技术,在不同的氮气分压(0.5~2.5 Pa)和脉冲偏压(0~-300 V)条件下对TC4基体沉积CrNx薄膜,采用扫描电镜和透射电镜对镀膜过程中产生的熔滴现象进行分析研究。结果表明,升高氮气分压能减少靶材排出粒子团数量,改变等离子体轰击作用,从而控制熔滴数量及尺寸,改善薄膜表面平整度;脉冲偏压能够使熔滴与薄膜紧密结合,改变熔滴成分,在一定范围内能促进靶材成分熔滴的形成。
The CrNx thin films were deposited on the TC4 substrate under different partial pressure of nitrogen (0.5 ~ 2.5 Pa) and pulse bias (0 ~ 300 V) by arc ion plating technique. Scanning electron microscopy and transmission electron microscopy Droplet phenomenon analysis and research. The results show that increasing the partial pressure of nitrogen can reduce the number of particles discharged from the target and change the bombardment effect of the plasma to control the number and size of the droplets and improve the surface flatness. The pulse bias can make the droplet tightly adhere to the film and change Droplet composition, within a certain range to promote the formation of droplet target composition.