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高密度互连基板对精细线路的检查提出了更高的要求,文章论述了AOI在检查精细线路时面临的挑战与问题,对生产过程中精细线路的侦测提供了指引。
High-density interconnect substrate for the inspection of fine lines put forward higher requirements, the article discusses the AOI in the inspection of fine lines of the challenges and problems facing the fine lines in the production process to detect the guidance.