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5. Numerical Simulation of Superplastic Forming and Diffusion Bonding of Ti Alloys

Numerical Simulation of Superplastic Forming and Diffusion Bonding of Ti Alloys

来源 :材料科学技术学报 | 被引量 : 0次 | 上传用户：mnbin000

【摘 要】

：

The research on numerical simulation for combinative process of SPF/DB is carried out in this paper. The contacting problem of sheets is analyzed by using the p

【作 者】

：

Kaifeng ZHANG Wenbo HAN Wei WU 

【机 构】

：

School of Materials Science and Engineering

【出 处】

：

材料科学技术学报

【发表日期】

：

2004年期

【关键词】

：

Numerical simulation 

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The research on numerical simulation for combinative process of SPF/DB is carried out in this paper. The contacting problem of sheets is analyzed by using the penalty method. In order to solve the contact problem of different parts of the sheet, a new alg

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