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IGBT模块内部各层结构的热学特性容易受到外界条件(如封装工艺或封装原材料性能的变化等)的影响。文章利用结构函数的特性,经过对IGBT实际测量和计算,获得模块内部的结壳热阻,并根据不同材料的热阻和热容值对IGBT模块内部每层结构进行热特性分析。
The thermal characteristics of the various layers of the IGBT module are easily affected by the external conditions (such as the encapsulation process or the performance of the encapsulated raw material, etc.). In this paper, the thermal resistance of each module in the IGBT module is analyzed according to the thermal resistance and heat capacity of different materials by using the structural function.