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七十年代后期,国外在集成电路生产中,已广泛在砂轮划片机上用金刚石薄刀片切取硅片中的合格管芯,其收得率高,硅片的切缝细而平直,边缘爆裂较小,从而可提高硅片的利用率。进口的刀片早期为镍青铜-金刚石刀片(以下简称铜片),七八年后多为镍-金刚石刀片(以下简称镍片),两者均为环状(～φ50.8×40.0毫米),厚度为20～50微米;目前进口的多为25微米的镍-金刚石刀片。在本工作末期,又见到固结在砂轮划片机刀片夹具上的镍-金刚石整体刀片。据国外厂商声称,镍片的性能较铜片优越。
In the late seventies, foreign countries in the production of integrated circuits, has been widely in the wheel dicing saw with thin diamond blades cut silicon wafer qualified die, and its high yield, thin and straight silicon cutting, edge burst Smaller, which can improve the utilization of silicon. The imported blades were nickel bronze-diamond blades (hereinafter referred to as “copper blades”) and nickel-diamond blades (hereinafter referred to as “nickel blades”) after 1978. Both of them were ring-shaped (~ φ50.8 × 40.0 mm) Thickness of 20 to 50 microns; currently imported mostly 25 micron nickel - diamond blade. At the end of this work, we saw the nickel-diamond monolithic blade consolidated on a blade dicing saw blade. According to foreign manufacturers claim that the performance of nickel than copper superior.