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探究实际形状的焊点在跌落冲击载荷下的可靠性。焊接实验表明:回流曲线的加热因子越小,焊接得到的焊点的高度越高,直径越小;根据实际焊点形状参数建立PBGA器件的3D有限元模型并采用Input-G方法进行计算,计算结果表明:最大剥离应力值出现在PBGA最外端角点焊点的封装侧内边角;焊接得到的高度较高、直径较小的焊点抵抗跌落冲击载荷的能力较强;锡铅焊点的跌落寿命是无铅焊点的1.6倍。
To explore the reliability of the actual shape of the solder joint drop impact load. The welding experiments show that the smaller the heating factor of the reflow curve, the higher the height of the soldered solder joint and the smaller the diameter. The 3D finite element model of the PBGA device is established according to the shape parameters of the solder joint, and the input-G method is used to calculate The results show that the maximum peel stress appears at the package inside corner of the outermost corner solder joint of PBGA. The solder joints with higher height and smaller diameter have stronger ability to resist drop impact load. The drop life is 1.6 times that of lead-free solder joints.