The growth of Au-Sn intermetallic compounds(IMCs) is a major concern to the reliability of solder joints in microelectronic,optoelectronic and micro-electronic-
The effect of heat treatment on microstructure, equilibrium hydrogen sorption pressure and plateau slope of LaNi3.8Al0.75Mn0.45 alloy was investigated. X-ray di
The surface microstructure and the surface segregation of FGH95 nickel-based superalloy powders prepared through plasma rotating electrode processing (PREP) hav