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本文提出一种针对多层微波电路基板的阻抗匹配方法。在多层微波电路基板上粘接微波芯片位置和微带线过渡部分的下层增加一层接地层,提高过渡部分电容,实现了0.1~22GHz频段内的小尺寸、高性能宽带阻抗匹配过渡,测试结果表明该过渡结构整个带内驻波小于1.5。
This paper presents a method for impedance matching of multilayer microwave circuit substrates. In the multilayer microwave circuit substrate bonding the location of the microwave chip and the transition of the microstrip layer of the underlying layer of ground layer to increase the transition part of the capacitor to achieve a 0.1 ~ 22GHz frequency band small size, high performance broadband impedance matching transition test The results show that the entire structure of the transitional structure has a standing wave less than 1.5.