论文部分内容阅读
1.中功率成为主流封装方式。目前市场上的产品多为大功率LED产品或是小功率LED产品,结合两者优点的中功率LED产品应运而生,成为主流封装方式。2.新材料在封装中的应用。由于耐高温、抗紫外以及低吸水率等更高更好的环境耐受性,热固型材料EMC、热塑性PCT、改性PPA以及类陶瓷塑料等材料将会被广泛应用。3.芯片超电流密度应用。今后芯片超电流密度将由350mA/mm2发展为700mA/mm2甚至更高,而芯片需
1. The power into the mainstream package. At present, most of the products on the market are high-power LED products or low-power LED products. The mid-power LED products combining the advantages of the two have emerged as the mainstream packaging method. 2 new materials in the package application. Materials such as thermosetting materials EMC, thermoplastic PCT, modified PPA, and ceramic-like plastics will be widely used due to higher and better environmental resistance such as high temperature resistance, UV resistance and low water absorption. 3. Chip ultra-current density applications. Future chip current density will be from 350mA / mm2 to 700mA / mm2 or even higher, while the chip needs