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国内一些半导体三极管生产厂在管芯制作过程中未采用表面钝化工艺.器件在封装过程中其管芯不能做到与外界严密隔绝,封装环境又不满足净化等级要求.因而产品质量将随环境条件而变化.由外界温度、湿度高、水汽、汗液以及各种污染物借助于温度以扩散、热运动、呼吸作用等被吸入器件内部,造成器件反向电流偏大,小电流放大系数下降,击穿电压蠕变,致使器件早期失效.本文对上述失效因素
Some domestic semiconductor transistor manufacturing plant in the production process does not use the surface passivation process. The device in the packaging process can not do with the core die, the packaging environment does not meet the purification level requirements. Therefore, product quality will vary with the environment The temperature, humidity, water vapor, sweat and various pollutants by the temperature to spread, thermal motion, respiration and so on are drawn into the device, causing the device reverse current is too large, small current amplification factor decreased, Breakdown voltage creep, resulting in early failure of the device.This paper on the failure factors