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采用直流磁控溅射方法于不同磁控管非平衡度状态下,通过单靶溅射模式在单晶Si衬底上制备了Cr膜。利用AFM、SEM、四探针测试仪及MTS Nano Indenter XP纳米压入测量仪分别对两种磁控管非平衡状态下所得Cr膜的微观形貌、电阻率、纳米硬度和抗磨损性进行了观察和分析,研究了不同磁控管非平衡状态下Cr膜微观结构与性能之间的关系。结果表明:磁控管非平衡状态显著影响着Cr膜的微观结构及性能。不同非平衡度状态下,镀层晶体均为沿Cr(110)择优生长的柱状晶组织。同一靶基距处,镀层晶粒尺寸及硬度与非平衡度大小成正比,而电阻率及抗磨损性能变化趋势却相反。靶基距亦为影响镀层微观结构和性能的重要因素之一。
The DC magnetron sputtering method was used to fabricate Cr film on a single crystal Si substrate by single target sputtering under different magnetron unbalance conditions. The morphology, resistivity, nano-hardness and abrasion resistance of the Cr films obtained by the two magnetrons were measured by using AFM, SEM, four-probe tester and MTS Nano Indenter XP nanoindentation measuring instrument The relationship between the microstructure and properties of Cr films under different magnetrons non-equilibrium conditions was investigated and analyzed. The results show that the magnetron non-equilibrium state significantly affects the microstructure and properties of Cr films. Under different non-equilibrium conditions, the deposited crystals are all columnar crystalline structures preferentially grown along Cr (110). The same target pitch, the coating grain size and hardness is proportional to the size of non-equilibrium, and the resistivity and wear resistance changes in the opposite trend. The target distance is also one of the important factors that affect the microstructure and properties of the coating.