Preparation of diamond/Cu microchannel heat sink by chemical vapor deposition

来源 :Journal of Central South University | 被引量 : 0次 | 上传用户:arthurzy
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A Ti interlayer with thickness about 300 nm was sputtered on Cu microchannels, followed by an ultrasonic seeding with nanodiamond powders. Adherent diamond film with crystalline grains close to thermal equilibrium shape was tightly deposited by hot-filame
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