The influence of temperature enhanced SnPb based on creep behavior of Cu particle composite soldere

来源 :中国焊接：英文版 | 被引量 : 0次 | 上传用户：hernquist

【摘要】

：

Creep property of solder alloys is one of the important factors to affect the reliability of soldered joints in SMT(surface mount technology). Particle-enhancem

【作者】

：

闫焉服闫红星陈拂晓张柯柯朱锦洪

【机构】

：

HennanUniversityofScienceandTechnology

【出处】

：

中国焊接：英文版

【发表日期】

：

2007年1期

【关键词】

：

铜颗粒增强铅锡基复合焊接接头温度蠕变行为 creep rupture life composite soldered joints particle-

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Creep property of solder alloys is one of the important factors to affect the reliability of soldered joints in SMT(surface mount technology). Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than

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The influence of temperature enhanced SnPb based on creep behavior of Cu particle composite soldere

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