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The techniques used for the fabrication of photonic integrated circuit(PIC) chip are introduced briefly.Then a four channel DFB laser array integrated with MMI coupler and semiconductor optical amplifier(SOA) fabricated with butt-joint technique,varied ridge width and holographic exposure techniques is reported.
The techniques used for the fabrication of photonic integrated circuit (PIC) chip are now briefly.. A four channel DFB laser array integrated with MMI coupler and semiconductor optical amplifier (SOA) fabricated with butt-joint technique, varied ridge width and holographic exposure techniques is reported.