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以1,3,3-三甲基-1-苯基茚满为原料,通过硝化、还原反应制备5(6)-氨基-1-(4-氨基苯基)-1,3,3-三甲基茚满(PI-DA),其结构经FTIR、1H-NMR和LC-MS表征。以PIDA为固化剂,用DSC研究了E-44/PIDA固化反应,确定固化工艺条件,并用Kissinger及Ozawa方法分别计算得到该体系固化反应的表观活化能为56.48kJ/mol和60.76kJ/mol,结合Crane公式求出反应级数为0.88。研究结果表明,与4,4’-二氨基-二苯砜(DDS)相比,PIDA熔点较低且带有环状茚满结构,既降低了固化温度、缩短了固化时间,又提高了复合材料的耐热性。E-44/PIDA复合材料的玻璃化转变温度Tg=167.8℃,初始分解温度Td=361.71℃。
(6) -Amino-1- (4-aminophenyl) -1,3,3-tris Methylindane (PI-DA) whose structure was characterized by FTIR, 1H-NMR and LC-MS. Using PIDA as curing agent, the curing reaction of E-44 / PIDA was studied by DSC, and the curing process conditions were determined. The apparent activation energy of the curing reaction was calculated as 56.48kJ / mol and 60.76kJ / mol using Kissinger and Ozawa methods respectively. , Combined with Crane formula to find the reaction order of 0.88. The results show that, compared with 4,4’-diamino-diphenyl sulfone (DDS), PIDA has a lower melting point and a cyclic indane structure, which not only reduces the curing temperature, shortens the curing time but also improves the composite Material heat resistance. E-44 / PIDA composite glass transition temperature Tg = 167.8 ℃, the initial decomposition temperature Td = 361.71 ℃.