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DBC substrates are the standard circuit boardsfor power modules. Using the DBC technologythick copper foils (0.125mm - 0.Tmm) arecladded to Alumina or Aluminum Nitride,The strong adhesion of the copper to ceramicbond reduces the thermal expansion coefficientin horizontal direction only slightly above theTEC of the ceramic itself. This allows directsilicon attach of large dies without using TECcontrolling layers.As DBC technology is using copper foils,integralleads overhanging the ceramic can be realized.A new via technology combined with integratedleads allow the design of low weight hermeticpackages with improved thermal performance.High end multichip modules with extremely lowthermal resistance (<0.03 K/W) can be achievedby the integration of 3-dimensional microchannels for liquid cooling underneath the powercircuit area.A new type of Alumina DBC with a flexuralstrength of>1000MPa and excellent temperaturecycling resistance has been developed.
DBC substrates are the standard circuit boards for power modules. Using the DBC technology thick copper foils (0.125 mm - 0.Tmm) are clad to Alumina or Aluminum Nitride, The strong adhesion of the copper to ceramic bond means the thermal expansion coefficient in horizontal direction only slightly above theTEC of the ceramic itself. This allows direct alloying of large dies without using TECcontrolling layers. As DBC technology is using copper foils, integralleads overhanging the ceramic can be realized. A new via technology combined with integrated leads allow the design of low weight hermeticpackages with progressive thermal performance. High end multichip modules with extremely lowthermal resistance (<0.03 K / W) can be achieved by the integration of 3-dimensional microchannels for liquid cooling underneath the power circuit area. A new type of Alumina DBC with a flexural strength of> 1000 MPa and excellent temperature cycling resistance has been developed.