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硅通孔(TSV)故障严重降低了三维集成电路的良率和可靠性。为了在制造流程中尽早精确地排除TSV故障,提出了一种基于仲裁器的键合前TSV测试方法。由于高电平信号通过故障TSV的延迟时间小于无故障TSV,比较被测TSV与无故障TSV的延迟时间,即可判断被测TSV是否存在故障,比较结果由仲裁器给出。依次将被测TSV的延迟时间与不同的延迟时间相比,可对其延迟进行区间定位,实现TSV故障分级。实验结果表明,该方案能够检测出开路电阻大于281Ω的电阻开路故障、泄漏电阻小于223 MΩ的泄漏故障,有效解决了两种TSV故障共存的检测问题。与现有同类方法相比,该方法提高了测试精度,增加了可检测故障范围,并且可以进行故障分级。
Through-silicon vias (TSVs) severely reduce the yield and reliability of 3D integrated circuits. To eliminate TSV faults as early as possible in the manufacturing process, an arbiter-based pre-bonding TSV test method was proposed. Since the delay time of the high-level signal passing through the faulty TSV is less than that of the non-faulty TSV, the delay time between the measured TSV and the non-faulty TSV can be compared to determine whether there is a fault in the tested TSV. The comparison result is given by the arbiter. In turn, the delay time of the tested TSV is compared with different delay time, and the interval of the delay can be positioned to achieve the TSV fault classification. The experimental results show that the proposed scheme can detect the open-circuit resistance with an open-circuit resistance greater than 281Ω and the leakage with a leakage resistance less than 223 MΩ, which effectively solves the problem of the coexistence of two types of TSVs. Compared with the existing similar methods, this method improves the testing accuracy, increases the range of detectable faults, and can classify faults.