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本文通过试验及数值计算的方法对激光微电子软钎焊过程进行了分析,指出在激光加热条件下,接合部的温度上升过程与汽相焊、红外辐射焊等方法不同,其特点是在加热初期,温度有急剧上升—下降(热冲击)现象。本文对此进行了探讨,证明激光束的高能量密度、严格的局部加热以及加热过程中钎料与引线及厚膜的接触状态、钎料本身的状态的变化是其根本原因。对利用激光移动加热对厚膜导体和进行钎料予热,以改善热冲击的方法以及利用接合材料热电势测量微接合部温度的方法做了更深入的研究。进一步的试验还说明,在激光加热条件下,钎料量及熔化纤料的运动形态都会影响到接合的质量。
In this paper, the laser microelectronic soldering process is analyzed through experiments and numerical methods. It is pointed out that under the condition of laser heating, the temperature rise process of the junction is different from the methods of vapor phase welding and infrared radiation welding, which is characterized by heating Early, the temperature has risen sharply - drop (thermal shock) phenomenon. In this paper, it is discussed that the high energy density of the laser beam, the severe local heating and the contact state between the solder and the lead and the thick film during the heating process and the change of the state of the solder itself are the fundamental reasons. Further studies have been conducted on a method for improving the thermal shock by thick film conductor and pre-heating the brazing material by laser displacement heating and a method for measuring the temperature of the micro junction using the thermoelectric force of the bonding material. Further tests also show that under the laser heating conditions, the amount of solder and the movement of molten fibers will affect the quality of bonding.