通过磁控共溅射方法制备了一系列不同Ti含量的Cu-Ti合金薄膜,采用EDS、XRD、TEM、AFM和纳米力学探针表征了薄膜的微结构和力学性能,研究了化合物对超过饱和固溶薄膜的强化作用。结果表明,由于溅射粒子的高分散性和薄膜生长的高非平衡性,Cu-Ti薄膜形成了超过饱和固溶体,晶格的剧烈畸变使Cu固溶体晶粒迅速细化。随Ti含量的增加,薄膜中产生高分散的细小Cu Tix化合物,并逐步形成Cu超过饱和固溶体纳米晶和细小化合物分布于非晶基体中的结构。与微结构的变化相应,薄膜的硬度随Ti含量的增加持续提高,并在含21.4%Ti(原子分数)时达到8.7GPa的最高值。高分散金属间化合物的存在是Cu-Ti合金薄膜在形成非晶结构后硬度得以继续提高的原因。 A series of Cu-Ti alloy films with different Ti content were prepared by magnetron sputtering method. The microstructure and mechanical properties of the films were characterized by EDS, XRD, TEM, AFM and nano-mechanical probes. Solid solution film strengthening effect. The results show that due to the high dispersibility of sputtered particles and the high non-equilibrium of film growth, the Cu-Ti film forms over the saturated solid solution and the lattice distortion rapidly makes the grain of Cu solid solution rapidly refine. With the increase of Ti content, a finely dispersed Cu Tix compound is formed in the film, and a structure in which Cu exceeds the saturation solid solution nanocrystal and the fine compound is distributed in the amorphous matrix is ​​gradually formed. Corresponding to the change of the microstructure, the hardness of the film increases with the increase of Ti content and reaches the highest value of 8.7 GPa with 21.4% Ti (atomic fraction). The presence of highly dispersed intermetallics is responsible for the continued increase in hardness of the Cu-Ti alloy after the formation of an amorphous structure.