透明聚酰亚胺膜覆铜箔层压板现在透明和耐热挠性电路的开发取得了重大进展,已有几种透明材料与特殊的制造工艺。聚酰亚胺薄膜耐热性和物理性能都佳,但它们有一个橙色或棕色的颜色,膜的透明度很低,这阻碍了一些光学应用。聚酯薄膜是一种透明的基材,但它的耐热性太低。新的耐热树脂如LCP被认为是下一代挠性电路材料,然而它们不是透明的。DKN研究现在成功地合成了透明的聚酰亚胺树脂,带来了透明的聚酰亚胺薄膜作为耐热挠性电路的 Transparent Polyimide Film Copper Clad Laminate Now that significant progress has been made in the development of transparent and heat-resistant flex circuits, there are several types of transparent materials and special manufacturing processes. Polyimide films have good heat resistance and physical properties, but they have an orange or brown color and the transparency of the film is low, which hinders some optical applications. Polyester film is a transparent substrate, but its heat resistance is too low. New heat-resistant resins such as LCP are considered as next-generation flexible circuit materials, however, they are not transparent. DKN research has now successfully synthesized a transparent polyimide resin, bringing a transparent polyimide film as a heat-resistant flexible circuit