在VLSI的制造过程中,常常由于设计中布线的不均衡,导致芯片性能不稳定或者失效。文章根据一些工艺生产线上的实践,提出了“均衡布线”的概念,并且在集成电路设计、工艺等方面,提出了在非“均衡布线”时影响电路可靠性的一些主要因素(负载效应、应力迁移、电迁移、串扰等)及相应的解决措施。 In the VLSI manufacturing process, often due to uneven wiring in the design, resulting in chip performance instability or failure. According to the practice of some production lines, the article puts forward the concept of “balanced wiring”, and puts forward some main factors that influence the circuit reliability in non-balanced wiring in the aspect of integrated circuit design and process Load effect, stress migration, electromigration, crosstalk, etc.) and the corresponding solutions.