In this investigation,an attempt has been made to study the influence of welding consumables on the factors that influence cold cracking of armour grade quenche
Molecular dynamics (MD) simulations were applied to simulate the deformation process of copper with different density of parallel coherent twin boundaries (TBs)
<正>In this paper,polycrystalline silicon films were deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposition(ECR-PECVD)using SiH_4/A