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本文综述了近年来国外电镀及化学镀磁记录介质薄膜的最新研究进展、电镀及化学镀镀液组成、工艺条件及其对薄膜性能的影响、存在问题及发展方向等．磁记录介质薄膜的制备，过去一直采用溅射方法，近年来国外开展了电镀及化学镀方法制备的研究．电镀方法包括水溶液电镀（如：Ｎｉ－Ｆｅ、Ｆｅ－Ｃｏ合金等）和非水溶液电镀（如Ｔｂ－Ｆｅ、Ｎｄ－Ｆｅ、Ｔｂ－Ｆｅ－Ｃｏ合金等），化学镀则是在Ｎｉ－Ｐ、Ｃｏ－Ｐ合金的基础上，通过添加其它金属盐，得到磁记录介质薄膜，如：Ｃｏ－Ｎｉ－Ｐ、Ｃｏ－Ｗ－Ｐ、Ｃｏ－Ｍｎ－Ｐ、Ｃｏ－Ｎｉ－Ｒｅ－Ｐ合金等
In this paper, the latest research progress of foreign electroplating and electroless magnetic recording media films in recent years, the composition and technological conditions of electroplating and electroless plating baths, their influence on the properties of films, the existing problems and the development direction are summarized. In recent years, the sputtering method has been used in the preparation of magnetic recording media films. In recent years, foreign countries have carried out studies on the preparation of electroplating and electroless plating. Plating methods include aqueous plating (such as: Ni-Fe, Fe-Co alloy, etc.) and non-aqueous plating (such as Tb-Fe, Nd-Fe, Tb-Fe-Co alloy, etc.), electroless plating is in Ni-P, Co-P-Co, Co-Ni-P, Co-Ni-Re-P alloy and the like on the basis of Co-P alloy by adding other metal salts