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远端光接入点的设计是将光载无线通信(Radio-Over-Fiber,RoF),60GHz无线(片上带宽10~20GHz)和光纤到户(FTTH)服务集成在一起。器件在磷化铟的芯片上集成了若干可调无线电频率的发射器和光学接收器。可以在1 500到1 570nm波长范围的4个带宽内同时工作。设计芯片是在两个晶圆厂的多项目晶圆(Multi-project Wafer,MPW)的框架下进行。通过专用的设计工具和工艺设计工具包(Process Design Kits,PDKs),充分利用了通用集成技术和标准的结构单元(Building Blocks,BBs)带来的便利。
The remote optical access point is designed to integrate Radio-Over-Fiber (RoF), 60GHz wireless (10 to 20GHz on-chip bandwidth) and FTTH (Fiber to the Home) services. The device integrates several emitters and optical receivers with tunable radio frequencies on indium phosphide chips. It can operate simultaneously in 4 bandwidths in the 1 500 to 1 570 nm wavelength range. The design of the chip is carried out in the framework of the two wafer fab Multi-project Wafer (MPW). Take advantage of common integration technologies and standard Building Blocks (BBs) with dedicated Design Tools and Process Design Kits (PDKs).