文章基于等效热模型技术,将系统级封装中的多尺度复杂结构(例如,硅通孔插入层、焊接凸点层等)简化为由均匀媒质构成的等效结构,再进行整体封装结构仿真。推导得到的等效热导率模型和与数值仿真提取的参数吻合。与基于精确封装模型的仿真方案相比,等效模型法可显著减小计算资源消耗,同时保证仿真精度,适于复杂三维封装结构的热仿真问题。 Based on the equivalent thermal model, this paper simplifies the multi-scale complex structure (such as TSV, solder bump layer, etc.) in the system-in-package to an equivalent structure made of uniform medium, . The deduced equivalent thermal conductivity model is consistent with the parameters extracted by numerical simulation. Compared with the simulation scheme based on exact encapsulation model, the equivalent model method can significantly reduce the computational resource consumption while ensuring the simulation accuracy and is suitable for the thermal simulation of complex three-dimensional package structure.