论文部分内容阅读
介绍了几种纤维增强技术及其基材产品,并对它们在高密度互连PCB基板中的应用情况与涂树脂铜箔者进行了比较、讨论,表明了纤维增强型基材在高多层、高密度互连基板中应用的优越性;指出了选择HDI基材时应注意的问题。
Several fiber-reinforced technologies and their substrate products are introduced, and their applications in high-density interconnect PCB substrates are compared with those coated with copper foil. The results show that the fiber-reinforced substrate has a high multilayer , High-density interconnect substrate application of the advantages; pointed out the choice of HDI substrate should pay attention to the problem.