纳秒激光脉冲烧蚀硅产生的微纳结构具有广泛的应用前景。激光与硅相互作用过程涉及复杂动力学过程,本文利用1064nm、10ns激光脉冲烧蚀硅产生空洞结构,同时利用相爆炸理论对烧蚀形貌进行分析。研究结果表明:相爆炸使得硅材料发生剧烈的去除,在烧蚀中心产生深坑,而烧蚀产物在相爆炸的巨大压力作用下,高速飞溅,在坑外侧沉积。 Nanosecond laser pulse erosion of silicon micro-nano structure has a wide range of applications. The laser-silicon interaction involves a complex kinetic process. In this paper, the 1064nm, 10ns laser pulses were used to ablate silicon to produce a hollow structure. At the same time, the ablation morphology was analyzed by phase explosion theory. The results show that the phase explosion causes the silicon material to be drastically removed, resulting in a deep pit in the ablation center. The ablated product is splashed at high velocity and deposited outside the pit under the enormous pressure of phase explosion.